online free webinar

Radiation-Hardened Imaging Solutions, Compact and Integrated

Launch Date:
27/11/2025
Time (CET):
17h00
Join us for a technical webinar on the Magics Vision Series: 
a modular platform of radiation-hardened ICs for imaging, control, and integration in high-radiation environments. It includes sensors, serializers, power ICs, and motor drivers for compact digital inspection systems.
As the nuclear industry moves toward smarter and more connected systems, there’s a growing need for inspection electronics that combine performance, resilience, and integration flexibility. In this session, we’ll walk through the Vision platform architecture and highlight the MAG IMG002X1, a Full-HD, radiation-hardened CMOS image sensor qualified for 1 MGy. We’ll also present the new stackable camera modules and Evaluation Kit designed to accelerate development and simplify deployment in constrained or mobile applications.
This session is tailored for system integrators, design engineers, and developers working on inspection, control, or monitoring solutions in extreme environments. You’ll get practical insight into performance, use cases, and design-in support, followed by a live Q&A with the engineers behind the technology.

Key Features

Radiation-Hardened by Design

Built for high-radiation environments with >1 MGy (TID) tolerance, no shielding required.

Full HD CMOS Imager

Delivers 1920×1080 resolution at up to 30 FPS with a 5 µm pixel size and electronic rolling shutter.

Compact Ceramic Package

Integrated in a CLCC-104 (18 × 18 mm²) housing for space-constrained and embedded applications.

Digital Parallel Output

Provides 10/12-bit video output and SPI configuration interface for control and monitoring.

Monochrome and 
Color Versions

Available with monochrome or Bayer-pattern color filter for flexible use cases.

Evaluation Kit Available

The MAG-CAM1000x-N offers a plug-and-play reference system with imager, serializer, power supply, and driver components.

End-to-End 
Radiation-Tolerant Chipset

Includes serializer (MAG-CXP), power supply (MAG-PSU), and driver IC (MAG-DRV). All hardened to 1 MGy (TID).

System Integration Support

Modular board options and engineering support available to accelerate design-in and prototyping.

Speakers

online free webinar

Deep dive into our radiation-hardened imaging solution

Launch Date:
27/11/2025
Time (CET):
17h00